iPhone 5 Teardown

iFixit posted their teardown and as always it’s fascinating to look at. Chipworks did some analysis as well. Some observations:

  • Easier to repair – Looks to be substantially easier to repair than previous iPhones. Major win.
  • Broadcom nearly expunged? – Apple looks to be moving away from using Broadcom chips. The Broadcom BCM5976 touchscreen controller looks like all that’s left. I’m surprised as the iPad 3 included the Broadcom BCM4330 wireless chip. I assumed that would be in there.
  • New WiFi Chip – Interestingly Apple instead of a Broadcom BCM4330 went with a Murata 339S0171. Murata is apparently based on a Broadcom BCM4334 + Skyworks frontend chips according to Chipworks. Guessing this saves at the very least space. Possibly also power. Apple must be serious about cutting size/weight.
  • Lots of Qualcomm inside – Not a shocker for an LTE device.
  • Got rid of the linear oscillating vibrator – I wonder why this is. It seems in every way superior to keep the linear oscillating vibrator vs the rotational motor with counterweight. No idea why they would have done that. Cost?
  • Easier to repair home button? – The home button is the weak point of the iPhone hardware wise. It inevitably becomes less sensitive, and for some will just die. This appears to be stronger and easier to repair.
  • Sony based image sensor – Chipworks identified the rear camera as a Sony design, but not much than that. The Galaxy SIII uses the Sony IMX145, which the iPhone 4S also used. Presumably this is the next generation based on the specs.